SMT Assembly
At YekaTech we deliver consistent, high-quality solutions for single- and double-sided electronic boards in an ESD-controlled environment in line with IPC standards. Depending on customer requirements, SMT assembly can be carried out with leaded or lead-free solder paste, as well as with adhesive (glue) application.
After reflow, every board is inspected quickly and accurately with high-resolution AOI (Automated Optical Inspection) equipment for solder joints, component shift and orientation. If a process-related fault is detected, the affected boards are sent for rework and the fault is corrected.
Materials used on the board can be supplied either by us or by the customer. Customer-owned materials are stored in our warehouse on dedicated shelves, and during production planning the customer is informed with reports showing stock and shortage status.
SMT Assembly Specifications:
Component Height: 25 mm minimum
Component Size: 01005
Placement Accuracy: ±50 µm @ laser centering / ±30 µm @ vision centering
Component Range: 1.0×5 mm – 74×74 mm
Placeable PCB Size: max. 700 × 460 mm / min. 50 × 40 mm
TH Assembly
Through-hole components are placed on the boards on manual assembly lines and then soldered with leaded or lead-free solder in our wave soldering machines. Components on manually assembled boards are checked for value, orientation and solder quality. In TH assembly and hand soldering, our highly trained operators combine expert workmanship and hand precision, using temperature-controlled digital soldering irons with leaded or lead-free solder according to customer requirements. Boards assembled by our TH team then pass through our wave soldering machine, and the components on hand-assembled boards are checked once more for value, orientation and solder quality.